DocumentCode
3162392
Title
Package Development for MEMS Based 3D Micro-Mirror Optical Bio-Probe for OCT Application
Author
Chen, W.S.K. ; Premachandran, C.S. ; Ratmin, Ahmad Khairyanto Bin ; Singh, Janak ; Yoon, Seung Wook
Author_Institution
Inst. of Microelectron., Singapore
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
347
Lastpage
351
Abstract
A miniaturized probe for MEMs based devices used in OCT application has been developed. Laser and mechanical dicing are used for singulating the released MEMs devices, however resulted in damaged devices. Therefore, thick photoresist is used to overcome and protect the devices during dicing. A fluxless solder ball process using different ball dimensions are experimented. Silicon bench is used for assembly of optical fiber and GRIN lens. Flex circuit is used to connect to the outside world by means of wirebonding.
Keywords
electronics packaging; micromechanical devices; optical tomography; 3D micromirror optical bioprobe; MEMS; OCT application; fluxless solder ball process; laser dicing; mechanical dicing; miniaturized probe; package development; Assembly; Biomedical optical imaging; Fiber lasers; Microelectromechanical devices; Micromechanical devices; Packaging; Probes; Protection; Resists; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location
Singapore
Print_ISBN
978-1-4244-1323-2
Electronic_ISBN
978-1-4244-1323-2
Type
conf
DOI
10.1109/EPTC.2007.4469813
Filename
4469813
Link To Document