Theoretical Stress Calculation and Experimental Results of "NCF-type Compliant-Bumped COG"

Author

Chen, Ming-Yao ; An, Chao-Chyun ; Chang, Shyh-Ming ; Kao, Kuo-Shu ; Tsang, Jimmy ; Yang, Sheng-Shu ; Chen, Chih ; Lin, Chung-Kuang

Author_Institution

Taiwan TFT LCD Assoc., Hsinchu

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

71

Lastpage

74

Abstract

Non-conductive-film (NCF) bonding method ensures the micro-order direct bonding between the IC electrode and circuit substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the substrate. The stress analysis results are used to identify the appropriate temperature range for the given NCF bonding structure. Both analytical and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress and low, and stable connection resistance at various environmental temperatures. In addition, the reliability test results will be discussed.

Keywords

bonding processes; chip scale packaging; fine-pitch technology; integrated circuit interconnections; integrated circuit reliability; liquid crystal displays; stress analysis; IC chip; IC electrode; NCF bonding structure; NCF-type compliant- bumped COG; chip-on-glass technology; circuit substrate electrode; environmental temperature; high compressive stress; microorder direct bonding; nonconductive-film bonding method; reliability test; stable connection resistance; stress analysis; super fine pitch COG bonding process; theoretical stress calculation; Bonding; Electrodes; Electronic equipment testing; Glass; Integrated circuit layout; Integrated circuit modeling; Solid modeling; Substrates; Temperature; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469816

Filename

4469816