• DocumentCode
    3162579
  • Title

    In-Situ Investigation of Lead-Free Solder Alloy Formation using a Hot-Plate Microscope

  • Author

    Bergmann, René ; Tang, Peter Torben ; Hansen, Hans Nørgaard ; Møller, Per

  • Author_Institution
    Tech. Univ. of Denmark, Lyngby
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    252
  • Lastpage
    256
  • Abstract
    This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated. Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important phases of the Au-Sn system. The measured values are comparable to those found in the literature. An outlook to further research is also given.
  • Keywords
    Vickers hardness; gold alloys; hardness testing; image processing; optical microscopy; solders; tin alloys; AuSn; AuSn-based solder spheres formation; Vickers microhardness measurement; hot-plate microscope; in-situ analysis tool; lead-free solder alloy formation; sample preparation method; un-oxidized solder spheres formation; Environmentally friendly manufacturing techniques; Gold; Lead; Microscopy; Optical films; Optical imaging; Petroleum; Phase measurement; Silicon; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1323-2
  • Electronic_ISBN
    978-1-4244-1323-2
  • Type

    conf

  • DOI
    10.1109/EPTC.2007.4469822
  • Filename
    4469822