Electronics packaging-a graduate course for Rutgers University School of Electrical and Computer Engineering

Author

Caggiano, Michael F.

Author_Institution

Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA

fYear

2001

fDate

2001

Firstpage

401

Lastpage

404

Abstract

In this talk I will profile a course in electronic packaging that I am introducing for the spring semester 2001 at Rutgers University Graduate School of Electrical and Computer Engineering. Packaging and its effects on the electrical signal integrity of electronic devices are not addressed in any of the existing courses at Rutgers. Electronic noise and signal distortion are introduced in Transistor Circuit Design and Integrated Transistor Circuit Design. However, the proposed course Electronics Packaging will deal with the electrical characterization and modeling of the parasitic of integrated circuit packaging. The course will be targeted to the general graduate population of Master´s students and industry part time graduate students that have a background in circuit analysis. Ph.D. students in Solid State and VLSI design will also find the course useful due to the modeling content

Keywords

educational courses; electronic engineering education; integrated circuit packaging; Rutgers University School of Electrical and Computer Engineering; electronic noise; electronic packaging; graduate educational course; integrated circuit; parasitics; signal distortion; signal integrity; Circuit analysis; Circuit synthesis; Distortion; Electronics packaging; Integrated circuit modeling; Integrated circuit noise; Integrated circuit packaging; Solid state circuits; Springs; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927757

Filename

927757