• DocumentCode
    3163032
  • Title

    SoC or SoP? A balanced approach!

  • Author

    Davidson, Evan

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    529
  • Lastpage
    534
  • Abstract
    System-on-a-Chip (SoC) is being touted by the semiconductor industry as a means for incorporating all of the important electronic functions required for a product onto a single die. The rest of the system unit would consist of cheap pedestrian parts from other vendors. The beauty of this well hyped concept is that all the value-add and revenue would go to the semiconductor companies while other technology providers will be left with low margin scraps. In some cases, this assertion from the semiconductor companies will be correct. On the other hand, there will be cases where SoC will not be the best business case because of excessively complex process requirements and oversized low yielding chips. For these cases, partitioning the SoC functions and placing them onto small few-chip-modules (FCMs) can result in a lower system cost with no performance sacrifice. It is the goal of this paper to justify this premise
  • Keywords
    integrated circuit packaging; multichip modules; few-chip-module; semiconductor industry; system-on-a-chip; system-on-a-package; Clocks; Companies; Cost function; Electronics industry; Industrial electronics; Job shop scheduling; Microprocessors; Moore´s Law; System-on-a-chip; Telephone sets;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2001. Proceedings., 51st
  • Conference_Location
    Orlando, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7038-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2001.927778
  • Filename
    927778