DocumentCode
3163032
Title
SoC or SoP? A balanced approach!
Author
Davidson, Evan
Author_Institution
IBM Corp., Poughkeepsie, NY, USA
fYear
2001
fDate
2001
Firstpage
529
Lastpage
534
Abstract
System-on-a-Chip (SoC) is being touted by the semiconductor industry as a means for incorporating all of the important electronic functions required for a product onto a single die. The rest of the system unit would consist of cheap pedestrian parts from other vendors. The beauty of this well hyped concept is that all the value-add and revenue would go to the semiconductor companies while other technology providers will be left with low margin scraps. In some cases, this assertion from the semiconductor companies will be correct. On the other hand, there will be cases where SoC will not be the best business case because of excessively complex process requirements and oversized low yielding chips. For these cases, partitioning the SoC functions and placing them onto small few-chip-modules (FCMs) can result in a lower system cost with no performance sacrifice. It is the goal of this paper to justify this premise
Keywords
integrated circuit packaging; multichip modules; few-chip-module; semiconductor industry; system-on-a-chip; system-on-a-package; Clocks; Companies; Cost function; Electronics industry; Industrial electronics; Job shop scheduling; Microprocessors; Moore´s Law; System-on-a-chip; Telephone sets;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-7038-4
Type
conf
DOI
10.1109/ECTC.2001.927778
Filename
927778
Link To Document