Development of a high density pixel multichip module at Fermilab

Author

Cardoso, G. ; Zimmermann, S. ; Kwan, S.W. ; Andresen, J. ; Appel, J.A. ; Cancelo, G. ; Christian, D.C. ; Cihangir, S. ; Downing, R. ; Hall, B.K. ; Hoff, J. ; Kasper, P.A. ; Mekkaoui, A. ; Yarema, R.

Author_Institution

Fermi Nat. Accel. Lab., Batavia, IL, USA

fYear

2001

fDate

2001

Firstpage

547

Lastpage

551

Abstract

At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The BTeV pixel detector is based on a design relying on a hybrid approach. With this approach, the readout chip and the sensor array are developed separately and the detector is constructed by flip-chip mating the two together. This method offers maximum flexibility in the development process, choice of fabrication technologies, and the choice of sensor material. This paper presents strategies to handle the required data rate and performance results of the first prototype and detector hybridization

Keywords

detector circuits; flip-chip devices; multichip modules; nuclear electronics; readout electronics; BTeV pixel detector; Fermilab; fabrication technology; flip-chip assembly; multichip module; readout chip; sensor array; sensor hybridization; Assembly; Bonding; Fabrication; Laboratories; Magnetic fields; Multichip modules; Protons; Prototypes; Radiation detectors; Sensor arrays;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927781

Filename

927781