MEMS single-chip microswitch array for re-configuration of telecommunication networks

This paper reports on a microelectromechanical (MEMS) switch array embedded and packaged on a single chip. The switch array is utilized for the automated reconfiguration of the physical layer of copper-wire telecommunication networks. A total of 25 individually controllable double-switches are arranged in a 6.7 times 6.4 mm² large 5 times 5 switch matrix allowing for any configuration of independently connecting the line-pairs of the five input channels to any line-pair of the five output channels. The metal-contact switch array is embedded in a single chip package, together with 4 metal layers for routing the signal and control lines and with a total of 35 I/O contact pads. The MEMS switches are based on an electrostatic S-shaped thin membrane actuator with the switching contact bar rolling between a top and a bottom electrode. This special switch design allows for low actuation voltage (21.23 V) to close the switches and for high isolation. The total signal line resistances of the routing network vary from 0.57 Omega to 0.98 Omega. The contact resistance of the gold contacts is 0.216 Omega