Mechanical bending fatigue reliability and its application to area array packaging

Author

Skipor, Andrew ; Leicht, Larry

Author_Institution

Adv. Technol. Center, Motorola Lab., Schaumburg, IL, USA

fYear

2001

fDate

2001

Firstpage

606

Lastpage

612

Abstract

The drive to finer pitch assemblies is in part due to smaller portable products. As these products reduce in size, the thickness of the printed circuit board must also reduce in thickness in proportion to the product size. These assemblies have become more flexible. Many of these products are assembled with area array packaging, which require numerous low-frequency mechanical deflections. The reliability emphasis has become more focused on isothermal bending fatigue. This paper will discuss a test method to evaluate bending fatigue reliability of 1.0 and 0.8 mm pitch area array packaging, the effect of printed circuit board (PCB) thickness, fatigue fracture morphology and its relation to solder joint location. Finite element results will also be presented to support and expand upon the findings in this study

Keywords

bending; fatigue; fine-pitch technology; finite element analysis; packaging; reliability; 0.8 mm; 1.0 mm; area array packaging; fine-pitch assembly; finite element analysis; flexible printed circuit board; fracture morphology; isothermal bending fatigue; mechanical deflection; portable product; reliability; solder joint; Assembly; Circuit testing; Fatigue; Finite element methods; Flexible printed circuits; Isothermal processes; Morphology; Packaging; Printed circuits; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927791

Filename

927791