Multichip module placement with heat consideration

A new algorithm for multichip module placement, MPH, using a combined quad-partitioning, genetic search and simulated annealing approach is presented here. In addition to minimizing wire length and vias, the algorithm places chips so that heat is evenly distributed over the substrate. The proposed algorithm obtains better solutions in less time than the simulated annealing and min-cut algorithms on the MCC industrial multichip module (MCM) benchmarks. In addition to the MCC benchmarks, industrial benchmarks for macrocell placement are used for testing the general placement power of the MPH algorithm. Results of these test cases are also presented