DocumentCode
3163546
Title
Challenge for future semiconductor development
Author
Hirose, M.
Author_Institution
Adv. Semicond. Res. Center, Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan
fYear
2002
fDate
6-8 Nov. 2002
Firstpage
2
Lastpage
3
Abstract
Progress in LSI technology has led to the concept of system-on-chip (SOC) that is still evolving to meet various applications for information processing and networking. SOC is composed of different IP cores such as MPU, RAM, RF, Analog, ASIC, DSP, Flash memory and even sensors. To realize high-performance and low power consumption in SOC, the design and fabrication of such complex systems need to overcome difficult technology roadblocks. This paper reviews key issues on 65 to 45nm node CMOS technology and related R&D challenges, together with the future prospects of silicon technology.
Keywords
CMOS integrated circuits; elemental semiconductors; integrated circuit design; low-power electronics; silicon; system-on-chip; 65 to 45 nm; CMOS technology; LSI technology; SOC; Si; future semiconductor development; low power consumption; silicon technology; system-on-chip; technology roadblocks; Application specific integrated circuits; CMOS technology; Digital signal processing; Energy consumption; Flash memory; Information processing; Large scale integration; Radio frequency; Read-write memory; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-031-3
Type
conf
DOI
10.1109/IMNC.2002.1178514
Filename
1178514
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