DocumentCode
316376
Title
A hybrid high-speed silica-based planar lightwave circuit platform integrating a laser diode and a driver IC
Author
Akahori, Y. ; Ohyama, T. ; Yanagisawa, M. ; Yamada, Y. ; Tsunetsugu, H. ; Akatsu, Y. ; Togashi, M. ; Mino, S. ; Shibata, Y.
Author_Institution
NTT Opto-Electron. Labs., Ibaraki, Japan
Volume
3
fYear
1997
fDate
22-25 Sep 1997
Firstpage
359
Abstract
We have developed silica-based planar lightwave circuit platform by integrating an LD array and a two-channel LD driver IC operating at 9 Gb/s. The combination of AuSn and In solder bumps enabled the flip-chip bonding of the LD array and the driver IC on the same platform
Keywords
driver circuits; 9 Gbit/s; AuSn; In; In solder bumps; LD array; driver IC; flip-chip bonding; hybrid high-speed silica-based planar lightwave circuit platform; laser diode; laser diode integration; silica-based planar lightwave circuit platform; two-channel LD driver IC;
fLanguage
English
Publisher
iet
Conference_Titel
Integrated Optics and Optical Fibre Communications, 11th International Conference on, and 23rd European Conference on Optical Communications (Conf. Publ. No.: 448)
Conference_Location
Edinburgh
ISSN
0537-9989
Print_ISBN
0-85296-697-0
Type
conf
DOI
10.1049/cp:19971564
Filename
626779
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