DocumentCode :
3164204
Title :
A pressure sensor using flip-chip on low-cost flexible substrate
Author :
Xiao, Guo-Wei ; Chan, Philip C.H. ; Teng, Annette ; Cai, Jian ; Yuen, Matthew M F
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ., China
fYear :
2001
fDate :
2001
Firstpage :
750
Lastpage :
754
Abstract :
The packaging of microelectromechanical systems (MEMS) is complex and it is essential to the successful commercialization of many MEMS devices. In this paper, a pressure sensor and an actuator were assembled on a flexible substrate using FCOF technology. A photolithography process was developed to meet the solder bump fabrication requirement of the sensor chip. Eutectic solder bumps (63Sn/37Pb) with 250 μm pitch were fabricated using the electroplating process. The flexible substrate and flip-chip process were designed for the MEMS package. The electrical test results of the MEMS package satisfied the requirements of devices. The samples were evaluated and inspected using various techniques, such as scanning acoustic microscope (SAM), X-ray imaging, scanning electron microscopy (SEM), etc. The flatness of the flexible substrate was essential to the underfill process and reliability of FCOF technology. Most of the shear failure was located at the interface between the solder mask and flexible substrate after the flip-chip assembly
Keywords :
X-ray imaging; acoustic microscopy; electroplating; encapsulation; flip-chip devices; microsensors; photolithography; pressure sensors; scanning electron microscopy; semiconductor device packaging; soldering; 250 micron; FCOF; X-ray imaging; electroplating process; flip-chip; low-cost flexible substrate; microelectromechanical systems; packaging; photolithography process; pressure sensor; scanning acoustic microscope; scanning electron microscopy; shear failure; solder bump fabrication requirement; solder mask; underfill process; Actuators; Assembly; Commercialization; Fabrication; Lithography; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Packaging; Scanning electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-7038-4
Type :
conf
DOI :
10.1109/ECTC.2001.927851
Filename :
927851
Link To Document :
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