Title :
Thermal research on material and structure of High-Power-LED module
Author_Institution :
Sch. of Art & Design, China Univ. of Min. & Technol., Xuzhou, China
Abstract :
The high junction temperature of High-Power-LED and low heat-release have directly influence on light luminoue efficiency and device lifetime, so how to maintain the temperature in proper range and improve the function of heat-release, become the key issue for the industrialization of high-power-LED. In this paper, it is given that reducing thermal resistance is the best way to lower temperature of LED. Furthermore, the thermal performance of material, packaging and module structure have been analysed in details, In the end, by reasonable design, it shows two novel module structures and analyses their advantages in heat-release.
Keywords :
light emitting diodes; modules; packaging; thermal resistance; heat release; high junction temperature; high-power-LED module; module structure; packaging; thermal resistance; Heating; Light emitting diodes; Lighting; Materials; Packaging; Temperature distribution; Thermal analysis; High-Power-LED; heat-release; material; module; structure;
Conference_Titel :
Consumer Electronics, Communications and Networks (CECNet), 2011 International Conference on
Conference_Location :
XianNing
Print_ISBN :
978-1-61284-458-9
DOI :
10.1109/CECNET.2011.5769086
