Experimental analysis of failure in embedded electronics and mechatronical systems under thermal stress

Embedded electronics are subjected to harsh environmental aggressions of thermal, mechanical and electrical nature. The mechanical stresses are aggravated by the important differences between the thermal and mechanical properties of different components and by the boundary conditions. In order to establish failure scenarios and optimizing these structures, it is essential to obtain accurate assessment of material parameters and correct identification of the boundary conditions. To this purpose, experimental investigations are performed using Speckle Interferometry. This non contact measurement technique yielding full field, high resolution displacement fields is based on the properties of coherent light in order to obtain static or dynamic displacement information.