High-performance MCMs for mainframe computers

Author

Seinecke, Siegfried

Author_Institution

Siemens Nixdorf Inf. Syst., Munich, Germany

fYear

1992

fDate

4-8 May 1992

Firstpage

310

Lastpage

315

Abstract

Presents a basic scheme for water-cooled multichip modules (MCMs). Multichip modules are a very effective approach to achieve high packaging density, excellent cooling and high electrical performance of mainframe processors. Two characteristic approaches are compared, namely an MCM with flip-chip mounting and an MCM with micropacks. The electrical characteristics of chip-to-board connections, microwiring substrates and planar module connectors have to be carefully designed. The ICs should preferably be BiCMOS AS ICs with up to 80000 gate functions with optional embedded SRAMs of up to 360000-bit capacity. The mechanical construction, wiring and delay rules, and test requirements for such chips are considered.<>

Keywords

BiCMOS integrated circuits; application specific integrated circuits; cooling; mainframes; multichip modules; stimulated Raman scattering; 360000 bit; BiCMOS ASIC; chip-to-board connections; delay rules; electrical performance; embedded SRAMs; flip-chip mounting; gate functions; mainframe computers; mechanical construction; micropacks; microwiring substrates; packaging density; planar module connectors; test requirements; water-cooled multichip modules; wiring rules; BiCMOS integrated circuits; Ceramics; Cold plates; Connectors; Delay; Dielectric substrates; Integrated circuit packaging; Lead; Nonhomogeneous media; Pins;

fLanguage

English

Publisher

ieee

Conference_Titel

CompEuro '92 . 'Computer Systems and Software Engineering',Proceedings.

Conference_Location

The Hague, Netherlands

Print_ISBN

0-8186-2760-3

Type

conf

DOI

10.1109/CMPEUR.1992.218415

Filename

218415