New structure 1608 size chip tantalum capacitor -6.3 WV-10 μF with face-down terminals for fillet-less surface mounting

This paper introduces the smallest size, 1608 (in mm) size, and the newest series of chip tantalum capacitors having the highest capacitance value in the world at present by means of original new packaging technology and new assembly process. Recent requirements for tantalum chip capacitors from smaller digital mobile equipment, especially Mobile Phone, PDA (Personal Digital Assistant), Pager, DVC (Digital Video Camera), DSC (Digital Still Camera), MD Player (Mini-disk Player), are smaller size and lower profile with higher capacitance. As an answer for those requirements, we have developed 6.3 WV-10 μF in 1608 size (L=1.6O mm, W-0.85 mm, t-0.80 mm), which has original new structure by adopting original new process technologies, and has face-down terminals to be available fillet-less surface mounting instead of conventional style, 2012 Size (L=2.0 mm, W=1.25 mm, t=12 mm). The original new process means “Matrix Array Packaging Technology” using matrix lead frame, it means batch molding system instead of individual molding and processing system. 6.3 WV-10 μF in conventional style, 2012 size, is a typical item used for digital mobile equipment at present in Japan.; Therefore it is very important in Tantalum Capacitors Industry to develop 6.3 WV-10 μF in 1608 Size. Our new structure 1608 size is about three times higher in volumetric efficiency, compared to the conventional style, 2012 size. This item is the smallest in volume and the highest value in capacitance in the world at the present time