DocumentCode
3165043
Title
Microlens arrays with integrated thin film power monitors
Author
Payne, Annette ; Nemchuk, N. ; Domash, Lawrence
fYear
2001
fDate
2001
Firstpage
876
Lastpage
879
Abstract
VCSEL 1D or 2D arrays for parallel optical interconnect links require monitor photodiodes, but conventional discrete detectors as used in single lasers are not feasible for arrays. Aegis Semiconductor is developing 1D and 2D `smart´ microlens arrays with integrated power monitor sensors in the form of semi-transparent thin film silicon and silicon-germanium based photodiodes direct deposited by PECVD. The developmental 12 channel 820-860 nm VCSEL array monitor described here incorporates Adaptive Optics Associates´ process for molding epoxy-on-glass microlens arrays directly onto glass substrates bearing thin-film sensors. Transmission of the sensor / microlens package exceeds 75% at 850 nm, with responsivity 0.07 A/W (based on total incident optical power) and bandwidth >50 kHz. Experimental measurements of antireflection properties and wavelength dependence are reported. Integration of thin film sensors (and potentially transistors and other circuit elements) with microlenses combines optoelectronic and passive optical functions in one compact element
Keywords
microlenses; optical interconnections; photodiodes; plasma CVD; semiconductor laser arrays; surface emitting lasers; 820 to 860 nm; Aegis Semiconductor; PECVD; Si; SiGe; VCSEL; antireflection properties; integrated thin film power monitors; microlens arrays; monitor photodiodes; parallel optical interconnect links; passive optical functions; responsivity; semi-transparent thin film photodiodes; total incident optical power; wavelength dependence; Lenses; Microoptics; Optical arrays; Optical sensors; Semiconductor laser arrays; Semiconductor thin films; Sensor arrays; Thin film sensors; Transistors; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-7038-4
Type
conf
DOI
10.1109/ECTC.2001.927897
Filename
927897
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