• DocumentCode
    3165043
  • Title

    Microlens arrays with integrated thin film power monitors

  • Author

    Payne, Annette ; Nemchuk, N. ; Domash, Lawrence

  • fYear
    2001
  • fDate
    2001
  • Firstpage
    876
  • Lastpage
    879
  • Abstract
    VCSEL 1D or 2D arrays for parallel optical interconnect links require monitor photodiodes, but conventional discrete detectors as used in single lasers are not feasible for arrays. Aegis Semiconductor is developing 1D and 2D `smart´ microlens arrays with integrated power monitor sensors in the form of semi-transparent thin film silicon and silicon-germanium based photodiodes direct deposited by PECVD. The developmental 12 channel 820-860 nm VCSEL array monitor described here incorporates Adaptive Optics Associates´ process for molding epoxy-on-glass microlens arrays directly onto glass substrates bearing thin-film sensors. Transmission of the sensor / microlens package exceeds 75% at 850 nm, with responsivity 0.07 A/W (based on total incident optical power) and bandwidth >50 kHz. Experimental measurements of antireflection properties and wavelength dependence are reported. Integration of thin film sensors (and potentially transistors and other circuit elements) with microlenses combines optoelectronic and passive optical functions in one compact element
  • Keywords
    microlenses; optical interconnections; photodiodes; plasma CVD; semiconductor laser arrays; surface emitting lasers; 820 to 860 nm; Aegis Semiconductor; PECVD; Si; SiGe; VCSEL; antireflection properties; integrated thin film power monitors; microlens arrays; monitor photodiodes; parallel optical interconnect links; passive optical functions; responsivity; semi-transparent thin film photodiodes; total incident optical power; wavelength dependence; Lenses; Microoptics; Optical arrays; Optical sensors; Semiconductor laser arrays; Semiconductor thin films; Sensor arrays; Thin film sensors; Transistors; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2001. Proceedings., 51st
  • Conference_Location
    Orlando, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7038-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2001.927897
  • Filename
    927897