Title :
Multi-channel optical interconnection modules up to 2.5 Gb/s/ch
Author :
Eichenberger, Jerome ; Toyoda, Shuhei ; Takezawa, Naganori ; Keller, Chris ; Sugiyama, Masahiko ; Iwasaki, Yasunori
Author_Institution :
Optobahn Corp., Torrance, CA, USA
Abstract :
With the rapid growth of the telecom and datacom market, the information throughput in switching and routing systems such as digital cross-connects or IP routers is increasing immensely. This causes the systems to continually move to higher data rates and also to become more decentralized. The result is a huge demand for high-speed interconnects within those systems. We have developed a 4-channel transceiver link with a data rate of 2.5Gb/s/ch and are able to provide an ideal solution to overcome this data bottleneck. The transceiver modules incorporate a 1310 nm Fabry-Perot laser diode array and a maximum link length of 2 km is specified using single-mode fiber. Providing a hermetic seal on the package guarantees highest reliability. The package is also designed for solder reflow used in standard assembly lines. Our transceiver modules are now ready to be produced in large volume quantities
Keywords :
modules; optical fibre communication; optical interconnections; packaging; telecommunication network routing; transceivers; 0 to 2 km; 1310 nm; 2.5 Gbit/s; Fabry-Perot laser diode array; IP routers; digital cross-connects; four-channel transceiver link; hermetic seal; high-speed interconnects; multi-channel optical interconnection modules; package; reliability; routing systems; single-mode fiber; solder reflow; Diode lasers; Fabry-Perot; Optical arrays; Optical interconnections; Packaging; Routing; Semiconductor laser arrays; Telecommunication switching; Throughput; Transceivers;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927898
