Device processing technology for free-space optical interconnect system

Author

Oren, M. ; McCarthy, A. ; Tooley, F. ; Laprise, A.E. ; Plant, D. ; Kirk, A. ; Lu, Y. ; Zhao, J.

fYear

2001

fDate

2001

Firstpage

886

Lastpage

889

Abstract

A device processing technology was developed for fabricating arrays of detector/modulator chips used in a free-space optical interconnect system. The arrays are fabricated onto a GaAs/AlGaAs multi quantum well (MQW) epitaxial layer having an in-plane anisotropic strain. The packaged module array consists of a strain inducing substrate onto which the GaAs epitaxial layer is transferred, and bonded to a Si CMOS driver by flip chip technology. The module is attached to a printed circuit board (PCB), and two such boards were mounted into a free space optical interconnect demonstration system

Keywords

demodulators; flip-chip devices; optical interconnections; optical modulation; packaging; GaAs-AlGaAs; MQW epitaxial layer; detector/modulator chips; device processing technology; flip chip technology; free-space optical interconnect system; in-plane anisotropic strain; packaged module array; printed circuit board; Anisotropic magnetoresistance; Capacitive sensors; Epitaxial layers; Gallium arsenide; Optical arrays; Optical interconnections; Packaging; Quantum well devices; Sensor arrays; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927899

Filename

927899