Title :
Studies on a novel flip-chip interconnect structure - pillar bump
Author :
Wang, Tie ; Tung, Francisca ; Foo, Louis ; Dutta, Vivek
Author_Institution :
Advanpack Solutions Pte Ltd.
Keywords :
Assembly; Copper; Environmentally friendly manufacturing techniques; Lead; Packaging; Shape; Stress; Testing; Tin; Vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927917
