Spray coated photoresist over anisotropically etched deep Si cavities

Author

Singh, V.K. ; Sasaki, M. ; Jong Hyeong Song ; Hane, K.

Author_Institution

Dept. of Mechatronics & Precision Eng., Tohoku Univ., Sendai, Japan

fYear

2002

fDate

6-8 Nov. 2002

Firstpage

188

Lastpage

189

Abstract

Up to now, we have demonstrated the lithography on the anisotropically wet-etched Si cavities and optical fiber ends. However the fundamental understanding or detailed data relating to the performance of the three-dimensional lithography are not clear. In this study, the photoresist thickness distribution is examined changing the resist drying condition.

Keywords

elemental semiconductors; etching; photoresists; silicon; spray coatings; Si; anisotropic wet etching; deep silicon cavity; spray coated photoresist; three-dimensional lithography; Anisotropic magnetoresistance; Coatings; Etching; Fluid flow; Lithography; Mechatronics; Resists; Spraying; Surface tension; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International

Conference_Location

Tokyo, Japan

Print_ISBN

4-89114-031-3

Type

conf

DOI

10.1109/IMNC.2002.1178607

Filename

1178607

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3165455