DocumentCode
3165843
Title
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
Author
Luk, C.F. ; Chan, Y.C. ; Hung, K.C.
Author_Institution
Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, China
fYear
2001
fDate
2001
Firstpage
1040
Lastpage
1044
Abstract
Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs). GGI is a lead free process where the Au bumps and Au bond pads are joined together by heat and ultrasonic power under a pressure head
Keywords
disc drives; driver circuits; flip-chip devices; gold; hard discs; integrated circuit bonding; integrated circuit interconnections; ultrasonic bonding; Au bond pad; Au bump; Au-Au; chip-on-suspension assembly; driver IC chip; flip-chip bonding technology; gold-to-gold interconnection; hard disk drive; integrated circuit suspension; lead-free process; thermosonic bonding; ultrasonic bonding; Assembly; Driver circuits; Flip chip; Gold; Integrated circuit interconnections; Integrated circuit technology; Magnetic heads; Magnetic recording; Temperature; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-7038-4
Type
conf
DOI
10.1109/ECTC.2001.927942
Filename
927942
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