Solder joint crack propagation in plastic and ceramic packaged diodes mounted on insulated metal substrate

Author

Sangalli, Nicoletta ; Barker, Donald B.

Author_Institution

CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA

fYear

2001

fDate

2001

Firstpage

1059

Lastpage

1064

Abstract

The first objective of this paper is to identify some key design parameters for ceramic and plastic packaged diodes mounted on insulated metal substrate (IMS). The second objective is to predict their solder joint life. IMS is a metal substrate used to enhance heat dissipation in high power application. The key parameters analyzed are dielectric thickness, solder thickness and board material. Identifying the critical parameters is useful to increase the solder joint life especially for a ceramic package, which has a high CTE mismatch with the aluminum substrate. Experiments are conducted to study the crack growth rate and identify solder joint failure. Two models to predict the crack propagation in eutectic solder joint are considered, the Darveaux and the Energy Partitioning model

Keywords

ceramic packaging; cracks; plastic packaging; power semiconductor diodes; semiconductor device packaging; soldering; Al; CTE mismatch; Darveaux model; aluminum substrate; ceramic package; crack propagation; design parameters; dielectric thickness; energy partitioning model; eutectic solder joint life; heat dissipation; high power diode; insulated metal substrate; plastic package; Ceramics; Conducting materials; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; Diodes; Plastic insulation; Plastic packaging; Predictive models; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927947

Filename

927947