Characterization and analysis on the solder ball shear testing conditions

Author

Huang, Xingjia ; Lee, S. W Ricky ; Yan, Chien Chun ; Hui, Sam

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ., China

fYear

2001

fDate

2001

Firstpage

1065

Lastpage

1071

Abstract

This paper presents both experimental investigation and computational analysis on the solder ball shear testing conditions for ball grid array (BGA) packages. The experimental data of solder ball shear tests indicate that the ram height and the shear speed have substantial effects on the solder ball shear strength. The general trend shows that lower ram height and faster shear speed can result in higher ball shear strength. A two-dimensional finite element model is established to simulate the solder ball shear tests. The results in terms of load-displacement curve from computational analysis are in good agreement with the experimental data. Based on the computational stress analysis, an effort is made to interpret the failure mode of solder balls subject to the ball shear test

Keywords

ball grid arrays; failure analysis; finite element analysis; shear strength; soldering; stress analysis; ball grid array package; computational stress analysis; failure mode; load-displacement characteristics; ram height; shear speed; shear strength; solder ball shear testing; two-dimensional finite element model; Computational modeling; Electronics packaging; Failure analysis; Finite element methods; Laboratories; Mechanical engineering; Soldering; Stress; Surface-mount technology; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927949

Filename

927949