Comparison of multilayer organic and ceramic package simultaneous switching noise measurements using a 0.16 μm CMOS test chip

Author

Budell, T. ; Audet, J. ; Kent, D. ; Libous, J. ; Connor, D.O. ; Rosser, S. ; Tremble, E.

Author_Institution

IBM Corp., Essex Junction, VT, USA

fYear

2001

fDate

2001

Firstpage

1087

Lastpage

1094

Abstract

This paper presents a comparison of simultaneous switching-output noise measurements taken with a 0.16 μm CMOS test chip on two flip-chip multilayer packages: IBM´s new HyperBGA^TM high-density PTFE-based organic BGA, and an existing IBM ASIC-menu alumina-ceramic BGA. In two classes of tests, measured transmitted noise from the organic BGA was found to average less than half that of the ceramic BGA. Technology and design features of the chip and package test vehicles are described and compared. Several types of simulations, including extracted loop inductance and full-wave simulation of coupling parameters, identify various noise components in each package and elucidate the large differences in measured noise between the two packages

Keywords

CMOS integrated circuits; application specific integrated circuits; ball grid arrays; ceramic packaging; flip-chip devices; integrated circuit noise; integrated circuit packaging; plastic packaging; 0.16 micron; Al₂O₃; CMOS chip; IBM ASIC-menu alumina-ceramic BGA; IBM HyperBGA high-density PTFE organic BGA; ceramic package; coupling parameters; flip-chip multilayer package; full-wave simulation; loop inductance; organic package; simultaneous switching noise; Application specific integrated circuits; CMOS technology; Ceramics; Crosstalk; Noise measurement; Nonhomogeneous media; Packaging; Semiconductor device measurement; Signal design; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927954

Filename

927954