• DocumentCode
    3166186
  • Title

    Integrated modeling methodology for core and I/O power delivery

  • Author

    Radhakrishnan, Kaladhar ; Li, Yuan-Liang ; Pinello, William P.

  • Author_Institution
    Intel Corp., Chandler, AZ, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    1107
  • Lastpage
    1110
  • Abstract
    Traditionally core power delivery and I/O signal analysis were performed separately to analyze the performance of a microprocessor package. The coupling between I/O and core power delivery was assumed negligibly small. In this paper, we describe a methodology to for analyzing core and I/O power delivery using the same integrated model. Having an integrated model allows us to study the noise induced on the core power nets due to switching currents on the I/O nets and vice-versa. Having an integrated model also gives us the opportunity to study the relative merits of separating or combining the core and I/O power networks
  • Keywords
    integrated circuit modelling; integrated circuit packaging; microprocessor chips; I/O signal analysis; core power delivery; integrated model; microprocessor package; switching current; Circuit simulation; Distributed parameter circuits; Finite difference methods; Frequency; Packaging; Power supplies; Power system transients; Power transmission lines; Signal analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2001. Proceedings., 51st
  • Conference_Location
    Orlando, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7038-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2001.927961
  • Filename
    927961