DocumentCode :
3166186
Title :
Integrated modeling methodology for core and I/O power delivery
Author :
Radhakrishnan, Kaladhar ; Li, Yuan-Liang ; Pinello, William P.
Author_Institution :
Intel Corp., Chandler, AZ, USA
fYear :
2001
fDate :
2001
Firstpage :
1107
Lastpage :
1110
Abstract :
Traditionally core power delivery and I/O signal analysis were performed separately to analyze the performance of a microprocessor package. The coupling between I/O and core power delivery was assumed negligibly small. In this paper, we describe a methodology to for analyzing core and I/O power delivery using the same integrated model. Having an integrated model allows us to study the noise induced on the core power nets due to switching currents on the I/O nets and vice-versa. Having an integrated model also gives us the opportunity to study the relative merits of separating or combining the core and I/O power networks
Keywords :
integrated circuit modelling; integrated circuit packaging; microprocessor chips; I/O signal analysis; core power delivery; integrated model; microprocessor package; switching current; Circuit simulation; Distributed parameter circuits; Finite difference methods; Frequency; Packaging; Power supplies; Power system transients; Power transmission lines; Signal analysis; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-7038-4
Type :
conf
DOI :
10.1109/ECTC.2001.927961
Filename :
927961
Link To Document :
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