Title :
A comparison of large I/O flip chip and wire bonded packages
Author :
Bulumulla, S.B. ; Caggiano, M.F. ; Lischner, D.J. ; Wolf, R.K.
Author_Institution :
Lucent Technol. Bell Labs., Breinigsville, PA, USA
Abstract :
As many of the large ASICs integrate high speed I/O macro-cells, there is increasing interest in the electrical performance of high ball count packages. The wire bond interconnects, plating bars and package structures have come under close scrutiny as it has become paramount to improve the performance of large packages to meet system requirements. This work presents measured data on high ball count wire bond and flip chip packages and compares the performance of both types of packages. The results show the bandwidth limitation of the wire bond packages as well as the performance differences between different types of flip chip packages
Keywords :
application specific integrated circuits; flip-chip devices; integrated circuit packaging; lead bonding; ASIC; ball count; bandwidth; flip-chip package; high-speed I/O macro-cell; interconnect; plating bar; wire bonded package; Bandwidth; Bars; Bonding; Costs; Flip chip; Integrated circuit interconnections; Integrated circuit packaging; Radio frequency; Semiconductor device measurement; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927965
