Dual operational amplifier using flip-chip fine package of 1.0×1.0×0.6-mm with 8-pin counts

Author

Kurata, Hiroyuki ; Mitsuka, Kaoru ; Matsushita, Hikari

Author_Institution

New Japan Radio Co. Ltd., Saitama, Japan

fYear

2001

fDate

2001

Firstpage

1149

Lastpage

1153

Abstract

This 1.0×1.0×0.6-mm flip-chip fine package has a 0.35-mm pin pitch and 8-pin counts in which a dual operational amplifier (0.83×0.78×0.2-mm Si IC) is fabricated. The 91.4×58.1×0.2-mm arrayed ceramic substrate contains 2816 1.0×1.0-mm packages that are made by a flip-chip bond process. Chip-coat process executes underfill and overcoat processes simultaneously. Mount area of the FFP is only 4.4% the area of a shrink small outline package with 8-pin counts. The reliability of the FFP is almost same as that of the conventional resin mold package

Keywords

chip scale packaging; fine-pitch technology; flip-chip devices; integrated circuit reliability; operational amplifiers; soldering; 0.6 mm; 1 mm; arrayed ceramic substrate; chip-coat process execute; dual operational amplifier; flip-chip bond process; flip-chip fine package; overcoat process; reliability; thermosonic bonding; underfill; Bonding; Ceramics; Conductors; Electronic packaging thermal management; Fabrication; Gold; Operational amplifiers; Resins; Semiconductor device packaging; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927970

Filename

927970