DocumentCode
3166380
Title
Development of parallel array multiple wire strip
Author
Mori, Kunihiko ; Yamaguchi, Shigeo ; Higasiura, Atsushi ; Higuchi, Kazuhiro
Author_Institution
Tech. Dept., Furukawa Electr. Co. Ltd., Chiba, Japan
fYear
1995
fDate
18-21 Sep 1995
Firstpage
247
Lastpage
251
Abstract
There has been an increasing demand for downsizing and upgrading electrical and electronic appliances ranging from consumer products to service machinery. As one approach to materialization, inverter-controllers and switching power supplies are advancing toward higher-frequency operation. In regard to coil wire intended to reduce the HF resistance induced by the skin effect, those units have applied Litz wire comprised of stranded enamelled wires or tape-insulated copper foil or copper sheet. The Litz wire has weak points of workability for winding and a low-space factor. Likewise, copper foil or copper sheet produces considerable heat due to eddy current loss and also difficulty in its edge insulation treatment. The authors have developed a high-frequency-compatible wire which makes use of a remarkable combination of Litz wire and copper foil or sheet. Upon close analysis, a parallel array wire strip comprised of multiple wires arranged in tape form has been developed. This paper discusses the general characteristics and some sample applications
Keywords
coils; copper; insulated wires; HF resistance; Litz wire; applications; characteristics; coil wire; development; eddy current loss; edge insulation treatment; parallel array multiple wire strip; skin effect; stranded enamelled wires; tape form; tape-insulated copper foil; tape-insulated copper sheet; Coils; Consumer products; Copper; Electric resistance; Hafnium; Home appliances; Machinery; Power supplies; Skin effect; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location
Rosemont, IL
Print_ISBN
0-941783-15-4
Type
conf
DOI
10.1109/EEIC.1995.482371
Filename
482371
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