Title :
2008 IEEE international SOI conference proceedings
Abstract :
The following topics are dealt with: planar SOI devices; SOI memories; SOI photonics, MEMS, sensors and circuits; materials and 3D technologies; multi-gate SOI devices; SOI radiation effects and RF applications; device characterization, reliability, and modeling.
Keywords :
micromechanical devices; semiconductor device models; semiconductor device reliability; semiconductor storage; silicon-on-insulator; 3D technologies; MEMS; RF applications; SOI memories; SOI photonics; SOI radiation effects; Si; circuits; device characterization; materials; modeling; multi-gate SOI devices; planar SOI devices; reliability; sensors;
Conference_Titel :
SOI Conference, 2008. SOI. IEEE International
Conference_Location :
New Paltz, NY
Print_ISBN :
978-1-4244-1954-8
DOI :
10.1109/SOI.2008.4656264
