Title :
Electrical modeling of high speed interconnection links
Author :
De Geest, J. ; Sercu, S. ; Nadolny, J.
Author_Institution :
FCI Electron., ´´s-Hertogenbosch, Netherlands
Abstract :
In this paper a methodology is presented for the simulation and modeling of high speed interconnection links. To model a link, the link is divided into a number of sublinks and for each sublink a measurement based model is derived. Once a model for each sublink is available all models are connected together and a model for the complete link is obtained. Verification of the method is done by comparing simulation results with measurement results
Keywords :
S-parameters; circuit simulation; digital simulation; electric connectors; printed circuit accessories; electrical modeling; high speed interconnection links; measurement based model; simulation results; sublinks; Bandwidth; Circuit simulation; Computational modeling; Connectors; Crosstalk; Degradation; Integrated circuit interconnections; Integrated circuit measurements; Scattering parameters; Signal design;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927988
