DocumentCode
3166933
Title
Database on lead-free solders
Author
Siewert, T.A. ; Smith, D.R. ; Liu, S. ; Madeni, J.C.
Author_Institution
Mater. Reliability Div., Nat. Inst. of Stand. & Technol., Boulder, CO, USA
fYear
2001
fDate
2001
Firstpage
1312
Lastpage
1314
Abstract
The worldwide movement in the electronics industry to replace lead-tin eutectic solders with lead-free solders creates a need for critical data on the industry´s new lead-free solder compositions for these design and reliability models. Our team is working with the NEMI Lead-free Alloy Task Group to develop a comprehensive database
Keywords
data models; database management systems; electronic engineering computing; electronics industry; environmental factors; printed circuit manufacture; production engineering computing; reflow soldering; wave soldering; NEMI project; comprehensive database; design models; electronics industry; eutectic solder replacement; lead-free solders database; packaging; reliability models; solder compositions; Assembly; Consumer electronics; Databases; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Legislation; Materials reliability; NIST; Production;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-7038-4
Type
conf
DOI
10.1109/ECTC.2001.928000
Filename
928000
Link To Document