Title :
Modeling and analysis of parasitic resistance in double gate FinFETs
Author :
Tekleab, Daniel ; Zeitzoff, P.
Author_Institution :
IBM Semicond. R&D Center, Hopewell Junction, NY
Abstract :
A comprehensive model is presented to analyze the 3D source-drain resistance of undoped double gated FinFETs. The model incorporates the contribution of the spreading resistance, sheet resistance and the contact resistance. The spreading resistance is modeled using a standard 2D model generalized to 3D. The contact resistance is modeled by generalizing the 1D tranmission line model to 2D and 3D with appropriate boundary conditions. The model is compared to S/D resistance determined from 3D device simulations. We show excellent agreement between our model and the simulations.
Keywords :
MOSFET; contact resistance; semiconductor device models; silicon-on-insulator; transmission line theory; 1D transmission line model; 3D device simulations; 3D source-drain resistance; contact resistance; double gate FinFETs; parasitic resistance; sheet resistance; spreading resistance; standard 2D model; Conference proceedings; Decision support systems; Fiber reinforced plastics; FinFETs; Quadratic programming; Contact Resistance; Double Gate; FinFET; SOI; Series Resistance; Transmission Line Model;
Conference_Titel :
SOI Conference, 2008. SOI. IEEE International
Conference_Location :
New Paltz, NY
Print_ISBN :
978-1-4244-1954-8
Electronic_ISBN :
1078-621X
DOI :
10.1109/SOI.2008.4656289