DocumentCode :
3167284
Title :
High K polymer-ceramic nano-composite development, characterization, and modeling for embedded capacitor RF application
Author :
Rao, Yang ; Yue, Jireh ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2001
fDate :
2001
Firstpage :
1408
Lastpage :
1412
Abstract :
Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer-ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano-structure polymer-ceramic composite with very high dielectric constant (ετ=150) has been developed in this work. RF application of embedded capacitors requires that insulating material have high dielectric constant in higher frequency (GHz), low leakage current, high breakdown voltage and high reliability. A set of electric tests have been conducted in this work to characterize the properties of the in house developed novel high dielectric constant polymer-ceramic nano-composite. Results show that this material has fair high dielectric constant in RF range, low electric leakage and high breakdown voltage. An embedded capacitor prototype with capacitance density of 35 nF/cm2 has been manufactured using this nano-composite and spinning coating technology. The design of embedded passives is very important to its practical application. The commercial finite element software ANSYS and electric simulation software SPICE were used for the simulation of embedded capacitor performance in the RF range. This novel nano-composite can be used for the integral capacitors in the RF applications
Keywords :
SPICE; capacitors; dielectric materials; electric breakdown; filled polymers; finite element analysis; leakage currents; nanostructured materials; permittivity; spin coating; ANSYS; RF embedded capacitor; SPICE; breakdown voltage; capacitance density; computer simulation; dielectric constant; electrical properties; finite element model; high-k dielectric; integral passive device; leakage current; polymer-ceramic nanocomposite; reliability; spin coating; Application software; Capacitors; Conducting materials; Dielectric materials; Embedded software; High K dielectric materials; High-K gate dielectrics; Polymers; Radio frequency; Software performance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-7038-4
Type :
conf
DOI :
10.1109/ECTC.2001.928018
Filename :
928018
Link To Document :
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