Title :
Surface mountable package (OptoBGATM) for 10 G data link
Author :
Kishida, Yuji ; Niwa, Yoshiaki ; Kuba, Yutaka ; Komeda, Ryuji ; Setoguchi, Katsuhide ; Matsubara, Takahiro ; Yanagisawa, Mitsuo ; Tanahashi, Shigeo
Author_Institution :
R&D Center, Kyocera Corp., Kyoto, Japan
Abstract :
In an effort to provide a breakthrough in next-generation fiber optic data links, a new type of opto-electronic package has been developed using ceramic BGA technology (OptoBGATM). In this paper, we describe how the OptoBGATM has adequate electrical performance meeting OC-192 or other 10 Gbs transmission specifications. For demonstration, a 10 G serial transmitter is designed and tested to achieve sufficient electrical eye opening of LD driver output when compared to its specifications (LD driver-pulse transient time 35 ps, Imod=100 mA, 20-80%)
Keywords :
ball grid arrays; ceramic packaging; optical communication equipment; surface mount technology; 10 Gbit/s; 100 mA; 35 ps; OptoBGA; ceramic BGA technology; electrical eye opening; electrical performance; next-generation fiber optic data links; opto-electronic package; pulse transient time; serial transmitter; surface mountable package; transmission specifications; Assembly; Bonding; Capacitors; Electronics packaging; High speed optical techniques; Integrated circuit packaging; Optical devices; Optical transmitters; Packaging machines; Surface-mount technology;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.928022
