Title :
A novel method of fabricating 3D spot-size converter on (111) SOI
Author :
Fang, Na ; Yang, Zhifeng ; Wu, Aimin ; Chen, Jing ; Zhang, Miao ; Zou, Shichang ; Wang, Xi
Author_Institution :
State Key Lab. of Functional Mater. for Inf., Chinese Acad. of Sci., Shanghai
Abstract :
We present a novel method to realize 3D adiabatically Spot-Size Converter (SSC) structures by standard silicon micromachining technics, for efficient coupling from single-mode fiber or free-space to silicon photonic chip. The SSC is comprised of I/O waveguides and a 3D tapered coupler on silicon-on-insulator (SOI) substrate. The dimensions are decreased linearly in both vertical and horizontal directions from input facet to output facet. The slope in vertical direction was originated from the angle between the surface of (111) SOI wafer and the real (111) crystal plane. Fabrication of the device has large process tolerance, and its effectiveness was conformed by optical loss measurement.
Keywords :
CMOS integrated circuits; elemental semiconductors; integrated optics; micromachining; optical couplers; optical fabrication; optical waveguides; photolithography; plasma materials processing; silicon; silicon-on-insulator; sputter etching; 3D spot-size converter; 3D tapered coupler; CMOS; ICP etching; SOI(111) wafer; SSC structures; Si; Si-Jk; anisotropic etching; inductively coupled plasma etching; integrated optics; lithography; optical couplers; optical loss measurement; optical waveguides; oxygenation; silicon photonic chip; silicon-on-insulator substrate; standard silicon micromachining techniques; tolerance; Anisotropic magnetoresistance; Electromagnetic waveguides; Etching; Integrated optics; Lithography; Optical fiber couplers; Optical refraction; Optical surface waves; Optical waveguides; Silicon on insulator technology;
Conference_Titel :
SOI Conference, 2008. SOI. IEEE International
Conference_Location :
New Paltz, NY
Print_ISBN :
978-1-4244-1954-8
Electronic_ISBN :
1078-621X
DOI :
10.1109/SOI.2008.4656303
