Fundamental study on adhesion improvement for underfill using adhesion promoter

Author

Welsh, D.J. ; Pearson, R.A. ; Luo, S. ; Wong, C.P.

Author_Institution

Microelectron. Packaging Mater. Lab., Lehigh Univ., Bethlehem, PA, USA

fYear

2001

fDate

2001

Firstpage

1502

Lastpage

1506

Abstract

In this study, silane-based, titanate-based, and zirconate-based adhesion promoters were added to a model underfill formulation in an effort to improve adhesion. Die shear tests were performed to determine adhesion strength of an underfill with passivation materials such as SiO ₂ and Si₃N₄ before and after aging in a high temperature, high humidity environment. It was found that some adhesion promoters effectively improved the adhesion strength of epoxy underfill with passivation and its performance of adhesion retention during aging in a high temperature and high humidity environment. To further study the mechanism of hot-wet adhesion improvement via coupling agent addition to resin, flow-microcalorimetry (FMC) was used to study the the adsorption of various molecules onto a reactive surface

Keywords

adhesion; ageing; calorimetry; delamination; encapsulation; passivation; shear strength; Si₃N₄; SiO₂; adhesion promoter; adhesion retention; adhesion strength; aging; coupling agent addition; die shear tests; flow-microcalorimetry; hot-wet adhesion improvement; passivation material; underfill; Adhesives; Delamination; Electronic mail; Glass; Humidity; Materials science and technology; Packaging; Soldering; Surface cracks; Titanium compounds;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.928035

Filename

928035