Built-in temperature sensors for on-line thermal monitoring of microelectronic structures

Author

Arabi, Karim ; Kaminska, Bozena

Author_Institution

Opmaxx Inc., Beaverton, OR, USA

fYear

1997

fDate

12-15 Oct 1997

Firstpage

462

Lastpage

467

Abstract

Built-in temperature sensors increase the system reliability by predicting eventual faults caused by excessive chip temperatures. In this paper, simple and efficient built-in temperature sensors for the on-line thermal monitoring of microelectronic structures are introduced. The proposed temperature sensors produce a signal oscillating at a frequency proportional to the temperature of the microelectronic structure and therefore they are compatible to the oscillation-test method. Design and detailed characteristics of the sensors proposed based on CMOS 1.2 μm technology parameters are presented. The fabrication results show a small spread in the nominal oscillation frequency of sensors implemented and a good sensitivity of the oscillation frequency with respect to temperature variations. The sensors proposed require very small power dissipation and silicon area

Keywords

CMOS integrated circuits; integrated circuit testing; temperature measurement; temperature sensors; 1.2 micron; CMOS microelectronic structure; built-in temperature sensor; fabrication; fault detection; on-line thermal monitoring; oscillation frequency; power dissipation; reliability; silicon area; CMOS technology; Design methodology; Fabrication; Frequency; Microelectronics; Monitoring; Power dissipation; Reliability; Sensor phenomena and characterization; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer Design: VLSI in Computers and Processors, 1997. ICCD '97. Proceedings., 1997 IEEE International Conference on

Conference_Location

Austin, TX

ISSN

1063-6404

Print_ISBN

0-8186-8206-X

Type

conf

DOI

10.1109/ICCD.1997.628909

Filename

628909