• DocumentCode
    3168049
  • Title

    SEU cross-sections of 6T SOI SRAM

  • Author

    Liu, S.T. ; Hurst, A. ; Liu, H. ; Hughes, H. ; Mendicino, M. ; Reed, R.

  • Author_Institution
    TRUSTED Semicond. Solutions, Anoka, MN
  • fYear
    2008
  • fDate
    6-9 Oct. 2008
  • Firstpage
    131
  • Lastpage
    132
  • Abstract
    Partially depleted (PD) SOI CMOS technology has provided great flexibility to extend the performance of high density SRAM and leading edge microprocessors in various CMOS microelectronics products. In today´s ASICs for defense electronics embedded 6T SOI SRAMs are used extensively and the SEU performance must be understood. The purpose of this paper is to present a rudimentary methodology for estimating the limiting SEU cross- sections induced by protons (sigmaPL) and by heavy ions (sigmaHL) for these SRAMs. The value of sigmaPL is usually found for proton energy (E) ges 200MeV and that of sigmaHL found for linear energy transfer (LET) ges 94MeV-cm2/mg. Two interesting observations are noted for the limiting SEU cross-sections: (1) ADE-hardened SOI SRAM is proportional to sigmaHL of 6T SOI SRAM; and (2) the single event rate (SER) is nearly proportional to sigmaHL in a figure-of-merit (FOM) calculation.
  • Keywords
    CMOS memory circuits; SRAM chips; integrated circuit testing; radiation effects; ADE-hardened SOI SRAM; ASIC; CMOS microelectronics products; SEU cross-sections; defense electronics; embedded 6T SOI SRAM; figure-of-merit calculation; heavy ions; high density SRAM; leading edge microprocessors; linear energy transfer; partially depleted SOI CMOS technology; proton energy; single event rate; CMOS technology; Conference proceedings; Inverters; Laboratories; Lead compounds; Microprocessors; Protons; Random access memory; Silicon; Single event upset;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2008. SOI. IEEE International
  • Conference_Location
    New Paltz, NY
  • ISSN
    1078-621X
  • Print_ISBN
    978-1-4244-1954-8
  • Electronic_ISBN
    1078-621X
  • Type

    conf

  • DOI
    10.1109/SOI.2008.4656329
  • Filename
    4656329