DocumentCode :
3168049
Title :
SEU cross-sections of 6T SOI SRAM
Author :
Liu, S.T. ; Hurst, A. ; Liu, H. ; Hughes, H. ; Mendicino, M. ; Reed, R.
Author_Institution :
TRUSTED Semicond. Solutions, Anoka, MN
fYear :
2008
fDate :
6-9 Oct. 2008
Firstpage :
131
Lastpage :
132
Abstract :
Partially depleted (PD) SOI CMOS technology has provided great flexibility to extend the performance of high density SRAM and leading edge microprocessors in various CMOS microelectronics products. In today´s ASICs for defense electronics embedded 6T SOI SRAMs are used extensively and the SEU performance must be understood. The purpose of this paper is to present a rudimentary methodology for estimating the limiting SEU cross- sections induced by protons (sigmaPL) and by heavy ions (sigmaHL) for these SRAMs. The value of sigmaPL is usually found for proton energy (E) ges 200MeV and that of sigmaHL found for linear energy transfer (LET) ges 94MeV-cm2/mg. Two interesting observations are noted for the limiting SEU cross-sections: (1) ADE-hardened SOI SRAM is proportional to sigmaHL of 6T SOI SRAM; and (2) the single event rate (SER) is nearly proportional to sigmaHL in a figure-of-merit (FOM) calculation.
Keywords :
CMOS memory circuits; SRAM chips; integrated circuit testing; radiation effects; ADE-hardened SOI SRAM; ASIC; CMOS microelectronics products; SEU cross-sections; defense electronics; embedded 6T SOI SRAM; figure-of-merit calculation; heavy ions; high density SRAM; leading edge microprocessors; linear energy transfer; partially depleted SOI CMOS technology; proton energy; single event rate; CMOS technology; Conference proceedings; Inverters; Laboratories; Lead compounds; Microprocessors; Protons; Random access memory; Silicon; Single event upset;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 2008. SOI. IEEE International
Conference_Location :
New Paltz, NY
ISSN :
1078-621X
Print_ISBN :
978-1-4244-1954-8
Electronic_ISBN :
1078-621X
Type :
conf
DOI :
10.1109/SOI.2008.4656329
Filename :
4656329
Link To Document :
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