DocumentCode
3168049
Title
SEU cross-sections of 6T SOI SRAM
Author
Liu, S.T. ; Hurst, A. ; Liu, H. ; Hughes, H. ; Mendicino, M. ; Reed, R.
Author_Institution
TRUSTED Semicond. Solutions, Anoka, MN
fYear
2008
fDate
6-9 Oct. 2008
Firstpage
131
Lastpage
132
Abstract
Partially depleted (PD) SOI CMOS technology has provided great flexibility to extend the performance of high density SRAM and leading edge microprocessors in various CMOS microelectronics products. In today´s ASICs for defense electronics embedded 6T SOI SRAMs are used extensively and the SEU performance must be understood. The purpose of this paper is to present a rudimentary methodology for estimating the limiting SEU cross- sections induced by protons (sigmaPL) and by heavy ions (sigmaHL) for these SRAMs. The value of sigmaPL is usually found for proton energy (E) ges 200MeV and that of sigmaHL found for linear energy transfer (LET) ges 94MeV-cm2/mg. Two interesting observations are noted for the limiting SEU cross-sections: (1) ADE-hardened SOI SRAM is proportional to sigmaHL of 6T SOI SRAM; and (2) the single event rate (SER) is nearly proportional to sigmaHL in a figure-of-merit (FOM) calculation.
Keywords
CMOS memory circuits; SRAM chips; integrated circuit testing; radiation effects; ADE-hardened SOI SRAM; ASIC; CMOS microelectronics products; SEU cross-sections; defense electronics; embedded 6T SOI SRAM; figure-of-merit calculation; heavy ions; high density SRAM; leading edge microprocessors; linear energy transfer; partially depleted SOI CMOS technology; proton energy; single event rate; CMOS technology; Conference proceedings; Inverters; Laboratories; Lead compounds; Microprocessors; Protons; Random access memory; Silicon; Single event upset;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2008. SOI. IEEE International
Conference_Location
New Paltz, NY
ISSN
1078-621X
Print_ISBN
978-1-4244-1954-8
Electronic_ISBN
1078-621X
Type
conf
DOI
10.1109/SOI.2008.4656329
Filename
4656329
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