Title :
Phase detection for conductivity based on electromagnetic measurement system
Author :
Yan Fu ; Feng Dong ; Chao Tan
Author_Institution :
Sch. of Electr. Eng. & Autom., Tianjin Univ., Tianjin, China
Abstract :
In electromagnetic tomography, phase of measurements from receivers contain the significant information of conductivity for target to test. The quality of reconstruction image mainly depends on the precision of phase detection. To discuss the effects in this aspect, simulate the relative conditions by the finite element simulation software, COMSOL Multi-physics. Conduct simulations for the target in object field with different conductivity and simulate the conditions when the target place at different positions in object field. To verify the validity of the results from simulations, design a prototype EMT system. This system utilizes NI PXI-5105 board to collect the high frequency signal directly, which could guarantee the precision and simplify the complexity of hardware. Based on the prototype EMT system, use the salt solution with different conductivities as target and conduct a series of relevant experiments. Results from simulations and experiments show the same variation tendency for each condition. It makes foundation for the system developing and optimization in future.
Keywords :
biomagnetism; biomedical measurement; electric impedance imaging; image reconstruction; medical image processing; optimisation; tomography; COMSOL Multi-physics; NI PXI-5105 board; electromagnetic measurement system; electromagnetic tomography; finite element simulation software; hardware complexity; high frequency signal; image reconstruction quality; object field; optimization; phase detection precision; phase measurements; prototype EMT system; receivers; target conductivity; target place; Coils; Conductivity; Imaging; Impedance; Magnetic flux; Phase detection; Receivers; conductivity; electromeagnetic tomography; object field distribution; phase detection;
Conference_Titel :
Imaging Systems and Techniques (IST), 2013 IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-5790-6
DOI :
10.1109/IST.2013.6729688