Author :
Madjar, Asher ; Turski, Zygmond ; Li, Yifei
Author_Institution :
Dept. of Electr. & Comput. Eng., Temple Univ., Philadelphia, PA
Abstract :
The premise of GaN HEMT devices to offer superior power amplification performance in microwave frequencies lead to an extensive research in this field, and to numerous publications emphasizing individual performance records such as, current and power densities, linearity and break down voltage. The performance of these, primarily experimental devices, is often reported in the terms of their intended applications, offering either the saturated output power, or 3dB compressed output power, or OFDM and CDMA waveform-specific output power, making the comparison among the devices, and a comparison with other technologies such as LDMOS and GaAs rather difficult. The authors are engaged in the design of a wideband (10:1 BW) 50W at 1dB compression point linear power amplifier operating up to 2GHz. As a step in this process the performance of an actual, 3.6 mm periphery, pre-production GaN HEMT from CREE was determined. The device performance is simulated using CREE model, and it is compared with the measurements that were taken, both reported in this paper. The results obtained exhibit good convergence with the model, and are presented using the more common performance parameters such as power and efficiency at 1dB compression point, and the linearity in terms of IP3
Keywords :
III-V semiconductors; gallium compounds; high electron mobility transistors; semiconductor device models; wide band gap semiconductors; 3.6 mm; 50 W; CREE; GaN; HEMT; experimental devices; microwave frequencies; power amplifier; wide band gap; Gallium arsenide; Gallium nitride; HEMTs; Linearity; Microwave frequencies; Multiaccess communication; OFDM; Power amplifiers; Power generation; Voltage; GaN; HEMT; power amplifiers; wide band gap;