DocumentCode :
3168386
Title :
A low power signal-swing suppressing strategy using time-multiplexed differential data-transfer (TMD) scheme
Author :
Yamauchi, H. ; Matsuzawa, A.
Author_Institution :
Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
fYear :
1995
fDate :
9-11 Oct. 1995
Firstpage :
48
Lastpage :
49
Abstract :
This paper presents a signal-swing suppressing strategy which uses a time-multiplexed differential data-transfer (TMD) scheme, featuring shared complementary wires between adjacent signal-bits. TMD can be exploited to reduce the signal voltage-swing and to realize a charge-recycling bus (CRB) architecture. This enables a dramatic power reduction without the throughput-loss due to the time-multiplexing, while maintaining the same number of signal wires compared to a single signal line (SSL) scheme. This is because the differential transfer scheme inherently has over 4-times higher capability in terms of throughput and noise tolerance compared to SSL. To demonstrate the effectiveness of TMD and TMD with CRB (TM-CRB), power consumption comparisons were made between SSL, the parallel architecture (parallelism), TMD, and TM-CRB. For all measurements, the same throughput conditions were used based on the simulated and measured data of the 0.5 /spl mu/m CMOS devices. This paper shows why TMD and TM-CRB can reduce the power dissipation on heavily loaded data lines to less than 1/3 and 1/20, respectively, compared to the parallelism, while reducing the number of signal wires by half.
Keywords :
CMOS digital integrated circuits; microprocessor chips; parallel architectures; time division multiplexing; 0.5 micron; CMOS devices; charge-recycling bus; differential transfer scheme; heavily loaded data lines; low power signal-swing suppressing strategy; noise tolerance; parallel architecture; power consumption comparisons; shared complementary wires; throughput conditions; throughput-loss; time-multiplexed differential data-transfer; Clocks; Driver circuits; Latches; Power dissipation; Switches; Switching circuits; Throughput; Virtual manufacturing; Voltage; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Low Power Electronics, 1995., IEEE Symposium on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-3036-6
Type :
conf
DOI :
10.1109/LPE.1995.482459
Filename :
482459
Link To Document :
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