New solutions for high frequency electronic packaging

Author

Siebert, W. Peter

Author_Institution

Dept. of Inf. Technol. & Media, Mid Sweden Univ., Ostersund, Sweden

Volume

2

fYear

2003

fDate

11-16 May 2003

Firstpage

954

Abstract

A new concept for shielded enclosures of electronics is presented in this paper. An inexpensive doubled heat sink in extruded aluminum forms the base of the enclosure. The electronics are inserted into one part and is enclosed by a complementary shielding surface. The outer heat sink is cooled by forced ventilation. As openings are made redundant, seams between the parts of the enclosure are the only path for significant electromagnetic emissions. EMC-issues are also addressed in this paper; seams are modeled and simulated as short wave guides intercepted by screw joints. The simulations were carried out in CST Microwave Studio.

Keywords

aluminium; electromagnetic compatibility; electromagnetic shielding; electronics packaging; heat sinks; thermal management (packaging); ventilation; Al; CST microwave studio; EMC; complementary shielding surface; doubled heat sink; electromagnetic emissions; extruded aluminum; forced ventilation cooling process; high frequency electronic packaging; screw joints; shielded enclosures; short wave guides; Apertures; Electromagnetic measurements; Electromagnetic shielding; Electronics cooling; Electronics packaging; Frequency; Information technology; Telecommunications; Testing; Vents;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on

Print_ISBN

0-7803-7779-6

Type

conf

DOI

10.1109/ICSMC2.2003.1429069

Filename

1429069