• DocumentCode
    3169007
  • Title

    Engineering thermoplastic resins for coil forms and encapsulation

  • Author

    Fithian, Paul C. ; Neher, Sally B. ; Harboe-Schmidt, Peter

  • Author_Institution
    DuPont Eng. Polymers, Wilmington, DE, USA
  • fYear
    1995
  • fDate
    18-21 Sep 1995
  • Firstpage
    511
  • Lastpage
    515
  • Abstract
    Demand is exploding for high-performance coil forms and encapsulated coils and electronic devices. These components are essential for electronic control and safety systems in the automobiles of the 1990s, controls and power supplies for appliances, electronic lighting ballasts and the development of electric vehicles for the 21st century. In response, engineering polymer suppliers have developed a series of products capable of handling coil form requirements with UL 1446/IEC 85 electrical insulation systems (EISs) from Class B (130°C) to Class R (220°C) applications. Encapsulation polymers recognized in systems for Classes B, F and H have been developed, and a specialty polymer has been introduced for encapsulating automotive and other electrical components
  • Keywords
    coils; encapsulation; organic insulating materials; UL 1446/IEC 85 electrical insulation systems; automotive electrical components; coil forms; electronic control systems; electronic devices; electronic lighting ballasts; encapsulated coils; encapsulation polymers; engineering polymer suppliers; high temperature nylon; liquid crystal polymers; moldable composite sheet; polyamide 66; polyethylene terephthalate; safety systems; thermoplastic resins; Automotive engineering; Coils; Control systems; Electrical safety; Encapsulation; Lighting control; Polymers; Power engineering and energy; Resins; Vehicle safety;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings
  • Conference_Location
    Rosemont, IL
  • Print_ISBN
    0-941783-15-4
  • Type

    conf

  • DOI
    10.1109/EEIC.1995.482484
  • Filename
    482484