Thermal analysis of an integral-horsepower multichip power module (MCPM) based induction motor drive

Author

Hall, David M. ; Gumaste, Vijaylaxmi ; Olejniczak, K.J. ; Burgers, K.C. ; Malshe, A.P.

Author_Institution

Dept. of Electr. Eng., Arkansas Univ., Fayetteville, AR, USA

Volume

2

fYear

1997

fDate

5-9 Oct 1997

Firstpage

1282

Abstract

This paper presents the thermal analysis of a highly-integrated intelligent, integral-horsepower, three-phase induction motor drive based on multichip module (MCM) technology. This solid-state controller, known as a multichip power module (MCPM), uses known good die to obtain minimal footprint, volume, mass and cost, while maximizing efficiency, reliability, and manufacturability. Using a commercially-available finite-element analysis program, various substrate technologies are evaluated for thermal management efficacy

Keywords

finite element analysis; induction motor drives; multichip modules; reliability; thermal analysis; efficiency maximisation; finite-element analysis program; induction motor drive; integral-horsepower multichip power module; manufacturability maximisation; minimal cost; minimal footprint; minimal mass; minimal volume; reliability maximisation; solid-state controller; substrate technologies; thermal analysis; thermal management efficacy; Consumer electronics; Dielectric substrates; Electronic packaging thermal management; Induction motor drives; Induction motors; Integrated circuit packaging; Multichip modules; Thermal conductivity; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 1997. Thirty-Second IAS Annual Meeting, IAS '97., Conference Record of the 1997 IEEE

Conference_Location

New Orleans, LA

ISSN

0197-2618

Print_ISBN

0-7803-4067-1

Type

conf

DOI

10.1109/IAS.1997.629024

Filename

629024