DocumentCode
3169381
Title
I-cache configurability for temperature reduction through replicated cache partitioning
Author
Paul, Mathew ; Petrov, Peter
Author_Institution
ECE Dept., Univ. of Maryland at Coll. Park, College Park, MD, USA
fYear
2010
fDate
13-14 June 2010
Firstpage
81
Lastpage
86
Abstract
On-chip caches have been known to be a major contributor to leakage power as they occupy a sizable fraction of the chip´s real estate and as such have been the target of power optimization techniques. However, many of these techniques do not consider the effects of temperature on leakage power and can hence be suboptimal since leakage power rises rapidly with temperature. When large fractions of the cache are disabled and only a small partition is used, the power density increases significantly which leads to increased temperature and leakage. We propose a temperature reduction methodology that leverages recently introduced configurable caches, in order to not only assign to the task a cache partition commensurate to its current demand but also to minimize the associated power density and temperature. In order to counteract the effect of elevated power density and achieve temperature reductions, in the proposed technique each such cache partition is replicated and only one of the replicas is active at any time. The inactive partition replicas are placed into a low-power drowsy mode while the primary partition services the task´s instruction requests. By periodically switching the tasks association between replica cache partitions, the power density and hence the temperature are reduced.
Keywords
cache storage; optimisation; I-cache configurability; leakage power; on-chip caches; power optimization; replicated cache partitioning; temperature reductions; Cache memory; Educational institutions; Embedded computing; Embedded system; Energy consumption; Handheld computers; Hardware; Mobile computing; Multimedia systems; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Application Specific Processors (SASP), 2010 IEEE 8th Symposium on
Conference_Location
Anaheim, CA
Print_ISBN
978-1-4244-7953-5
Type
conf
DOI
10.1109/SASP.2010.5521143
Filename
5521143
Link To Document