DocumentCode :
316939
Title :
Planning and testing of wafer-treatment allocation
Author :
Rao, Suraj ; Vasanth, Karthik
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fYear :
1997
fDate :
35589
Firstpage :
70
Lastpage :
73
Abstract :
In this paper, we present techniques that can be used to answer the following two questions: (a) How many wafers need to be allocated per treatment to detect a given difference in a device performance metric? (b) How to determine if a given treatment significantly improved a performance metric? The approach presented here does not make any assumptions regarding the shape of the distribution or the spatial dependency structure for the within wafer performance measurements and remains applicable for a variety of statistics, such as, mean, variance, median, etc. The analysis method can be used in decisions regarding the appropriateness of allocating half and quarter wafer splits to a treatment
Keywords :
integrated circuit manufacture; integrated circuit testing; planning; production control; production testing; statistical analysis; IC production; device performance metric; statistics; wafer performance measurements; wafer-treatment allocation; CMOS process; Fluid flow measurement; Frequency measurement; Histograms; Instruments; Shape measurement; Statistical analysis; Statistical distributions; Testing; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Statistical Metrology, 1997 2nd International Workshop on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-3737-9
Type :
conf
DOI :
10.1109/IWSTM.1997.629416
Filename :
629416
Link To Document :
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