Planning and testing of wafer-treatment allocation

Author

Rao, Suraj ; Vasanth, Karthik

Author_Institution

Texas Instrum. Inc., Dallas, TX, USA

fYear

1997

fDate

35589

Firstpage

70

Lastpage

73

Abstract

In this paper, we present techniques that can be used to answer the following two questions: (a) How many wafers need to be allocated per treatment to detect a given difference in a device performance metric? (b) How to determine if a given treatment significantly improved a performance metric? The approach presented here does not make any assumptions regarding the shape of the distribution or the spatial dependency structure for the within wafer performance measurements and remains applicable for a variety of statistics, such as, mean, variance, median, etc. The analysis method can be used in decisions regarding the appropriateness of allocating half and quarter wafer splits to a treatment

Keywords

integrated circuit manufacture; integrated circuit testing; planning; production control; production testing; statistical analysis; IC production; device performance metric; statistics; wafer performance measurements; wafer-treatment allocation; CMOS process; Fluid flow measurement; Frequency measurement; Histograms; Instruments; Shape measurement; Statistical analysis; Statistical distributions; Testing; Threshold voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Statistical Metrology, 1997 2nd International Workshop on

Conference_Location

Kyoto

Print_ISBN

0-7803-3737-9

Type

conf

DOI

10.1109/IWSTM.1997.629416

Filename

629416