• DocumentCode
    3169471
  • Title

    Experimental research on resistance temperature characteristic of conductive composite materials used in large deformation sensor

  • Author

    Zhuo-dian, Liu ; Guo-qing, Zhou ; Bo, Liao

  • Author_Institution
    State Key Lab. for Geomechanics & Deep, China Univesity of Min. & Technol., Xuzhou, China
  • fYear
    2011
  • fDate
    16-18 April 2011
  • Firstpage
    3164
  • Lastpage
    3167
  • Abstract
    To research the resistance temperature characteristic of large deformation sensor element produced by the conductive composite materials based on rubber. A series of tests on resistance temperature characteristic of carbon fiber filled conductive silicone rubber are carried out. the results shows that it appears transition temperature during heating-cooling cycle range from 0D to 40D. The composite materials shows Negative Temperature Coefficient of resistance(NTC) phenomenon at temperatures below the transition temperature while it shows Positive Temperature Coefficient of resistance(PTC) phenomenon at temperatures above the transition temperature. The resistance of composite materials gradually decreases, and finally reaches a steady as the temperature cycle.
  • Keywords
    composite materials; deformation; mechanical variables measurement; rubber; sensors; carbon fiber filled conductive silicone rubber; heating cooling cycle range; large deformation sensor; negative temperature coefficient of resistance; positive temperature coefficient of resistance; resistance temperature characteristic; transition temperature; Carbon; Composite materials; Resistance; Resistance heating; Rubber; Temperature; Temperature sensors; carbon fiber; conductive composite materials; resistance temperature characteristic; temperature cycle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Consumer Electronics, Communications and Networks (CECNet), 2011 International Conference on
  • Conference_Location
    XianNing
  • Print_ISBN
    978-1-61284-458-9
  • Type

    conf

  • DOI
    10.1109/CECNET.2011.5769323
  • Filename
    5769323