Surface mount technology and power applications

Author

Blackwell, Glenn R.

Author_Institution

Purdue Univ., West Lafayette, IN, USA

fYear

1995

fDate

18-21 Sep 1995

Firstpage

647

Lastpage

650

Abstract

The author describes a half-day short course which introduces attendees to the basics of surface mount technology (SMT), comparing SMT to standard through-hole circuit board design and manufacturing techniques. Examples of equipment specific to SMT board assembly are available for attendees to examine and use. The use of concurrent engineering in sucessful SMT design and manufacturing is discussed. In addition, the course discusses some of the issues necessary to deal with power applications and thermal issues associated with SMT board design. Examples of software useful in thermal analysis of circuit boards are given. An overview of the short course schedule is also given

Keywords

circuit analysis computing; concurrent engineering; educational courses; electronic engineering education; integrated circuit manufacture; power engineering computing; power engineering education; power integrated circuits; surface mount technology; thermal analysis; SMT board assembly; circuit analysis software; circuit boards; concurrent engineering; design techniques; education; half-day short course; manufacturing techniques; surface mount technology; thermal analysis; Assembly; Concurrent engineering; Lead; Manufacturing; Marketing and sales; Packaging; Printed circuits; Soldering; Surface-mount technology; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Electronics Insulation Conference, 1995, and Electrical Manufacturing & Coil Winding Conference. Proceedings

Conference_Location

Rosemont, IL

Print_ISBN

0-941783-15-4

Type

conf

DOI

10.1109/EEIC.1995.482509

Filename

482509