• DocumentCode
    3169587
  • Title

    PTCR characteristics of single grain boundaries in barium titanate ceramics

  • Author

    Kuwabara, M. ; Morimo, K. ; Takahashi, S. ; Shimooka, H. ; Matsunaga, T.

  • Author_Institution
    Dept. of Appl. Chem., Kyushu Inst. of Technol., Kitakyushu, Japan
  • fYear
    1991
  • fDate
    33457
  • Firstpage
    729
  • Lastpage
    730
  • Abstract
    Positive temperature coefficient of resistivity (PTCR) characteristics of strictly single grain boundaries in barium titanate ceramics have been investigated. The results indicate that in the ceramic samples there existed grain boundaries exhibiting typically three different PTCR characteristics, which can be described as follows: 1) PTCR characteristics similar to those observed for usual ceramic samples, 2) an abrupt increase in resistivity by more than three orders at the Curie point, then, immediately followed by a monotonous decrease of it, and 3) substantially little or no resistivity jump. The second type of the PTCR characteristic cannot be interpreted at all by the Heywang model, which is based on the temperature dependence of the grain boundary barrier height determined by the dielectric constant in barium titanate which steeply decreases above the Curie point according to the Curie-Weiss law. A new possible mechanism of the PTCR effect is discussed
  • Keywords
    barium compounds; electrical resistivity; ferroelectric Curie temperature; ferroelectric materials; grain boundaries; permittivity; piezoceramics; BaTiO3; Curie point; Curie-Weiss law; Heywang model; PTCR characteristics; ceramics; dielectric constant; grain boundary barrier height; mechanism; positive temperature coefficient of resistivity; single grain boundaries; temperature dependence; Barium; Ceramics; Conductivity; Dielectric constant; Grain boundaries; Morphology; Semiconductivity; Surface resistance; Temperature; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
  • Conference_Location
    University Park, PA
  • Print_ISBN
    0-7803-1847-1
  • Type

    conf

  • DOI
    10.1109/ISAF.1994.522472
  • Filename
    522472